Senior Manufacturing Engineer – Thin Film Engineering (PVD, PECVD, ALD & RIE)

About Ensurge Micropower Ensurge Micropower (OSE: ENSU) is a pioneer in solid-state microbattery technology, enabling the next generation of intelligent, connected devices. Leveraging proprietary thin-film and roll-to-roll manufacturing, Ensurge delivers safe, high-energy-density batteries for wearables, health tech, industrial sensing, and defense applications. As our technology transitions from development to production, disciplined manufacturing execution becomes the differentiator. Role Overview Ensurge is seeking a Senior Manufacturing Engineer (IC) to own and scale the Thin-Film Engineering processes — deposition (PVD/Sputtering, PECVD, ALD) and etch (RIE) — from pilot through early production. This role is not just about process — it is about delivering manufacturing results. Responsibilities Own daily manufacturing performance for the PVD/Sputtering, PECVD, ALD, and RIE process areas - Drive output, yield, uptime, and cycle time - Support production directly — troubleshooting issues in real time - Partner with Operations to ensure line execution meets plan Convert R&D processes into repeatable, production-ready workflows - Define and lock critical process parameters (CPPs) — e.g., chamber pressure, Ar/process gas flow, RF/DC power, substrate bias, deposition rate, film stress and thickness uniformity targets (PVD/PECVD); precursor/co-reactant pulse and purge times, cycle count, growth per cycle (GPC), and substrate temperature (ALD); RF power, gas chemistry (e.g., CF4/O2/Cl2), etch rate, selectivity, sidewall profile/anisotropy, DC bias, and endpoint detection (RIE) - Define and lock control limits and OCAPs - Ensure processes are robust, stable, and scalable Work with Equipment Engineering to: - Define tool requirements (sputter cathodes/targets, PECVD chambers, ALD reactors and precursor delivery systems, RIE/ICP-RIE chambers and endpoint detection systems, RF/DC power supplies, vacuum, gas delivery, and abatement/scrubber systems) - Improve reliability and uptime - Implement process-driven upgrades - Lead tool qualification and process acceptance - Ensure equipment supports throughput, precision, and repeatability Own flow from substrate input → deposition/etch → downstream handoff to assembly - Reduce bottlenecks, WIP, and inefficiencies - Improve line balance and production scheduling alignment - Support layout and flow improvements as the system scales Partner with Quality to implement: - SPC and process control on film thickness, stress, uniformity, and conformality - Film characterization (ellipsometry, profilometry, XRD, SEM/AFM, four-point probe) to validate deposition results against CPPs - Traceability and data capture Build and maintain: - SOPs - Process specs - Control plans - Ensure manufacturing is data-driven and auditable    Lead structured RCA on: - Yield loss - Defects - Downtime - Use characterization data (SEM, XRD, cross-section imaging) to root-cause excursions - Implement sustainable fixes — not workarounds - Drive continuous improvement aligned to operational excellence principles (standard work, DMS, etc.) Qualifications Required - 7–12+ years in manufacturing engineering with thin-film deposition and etch (PVD/sputtering, PECVD, ALD, and/or RIE) in battery, semiconductor, or thin-film industries - Proven experience owning manufacturing processes on the floor - Strong track record of driving yield and throughput improvements - Experience supporting or leading pilot → production scale-up - Hands-on mindset — comfortable working directly with equipment, technicians, and operators - Working knowledge of thin-film characterization techniques (e.g., ellipsometry, profilometry, XRD, SEM) and their use in validating and controlling deposition processes Preferred - Understanding of film stress engineering, plasma physics, RF coupling, and DC self-bias - Understanding of plasma etch chemistry, selectivity, anisotropy, and endpoint detection (RIE/ICP-RIE) - Familiarity with ALD precursor chemistry, self-limiting surface reactions, and pulse/purge sequencing - Vacuum systems and chamber conditioning experience - Experience with image-based film/defect characterization (SEM, optical microscopy) and correlating characterization data back to process control limits - Experience with MES, traceability systems, or data-driven manufacturing Salary Range: $162,000-$198,000 The base salary range is specific to California. The salary of the final candidate selected for this role will be determined by a variety of factors, including, but not limited to, internal equity, experience, education, specialty, and training.